ENGtechnica

Category: Computing

  • Cincoze Launches Compact Rugged Computers for Factory, Military Use

    Cincoze Launches Compact Rugged Computers for Factory, Military Use

    TAIPEI, Taiwan, Jan 27, 2025 – Cincoze has launched the latest addition to the rugged computing – DIAMOND product line, the entry performance & compact industrial computer DC-1300 series. It packs enhanced performance and expansion flexibility in a compact 185 x 131 x 56.5 mm chassis. The new generation DC-1300 series can be equipped with an Intel Alder Lake-N processor, supports the essential I/O interfaces for industrial applications, and provides complete wireless transmission solutions (Wi-Fi, 5G, GNSS, etc.). The DC-1300 continues the legacy of the DC series for successful integration in space-limited industrial automation applications.

    4.5X Performance and Multiple Storage Options

    The new generation DC-1300 series supports the latest Alder Lake-N platform Intel Core i3-N305 processor, with computing performance of 4.5 times that of the previous generation. The DC-1300 supports up to 16GB DDR5 4800MHz in a single memory slot. It offers flexible storage options, such as 2.5-inch SATA HDD/SSD or Half-Slim SSD. Additionally, it supports expansion via the M.2 slot for NVMe SSD to meet the needs of different application scenarios.

    Innovative Stackable Expansion Box Design

    The DC-1300 has a set of native I/O interfaces, including LAN, USB, COM, and 4K DisplayPort, and can expand COM, DIO, display, and IGN functions through Cincoze’s exclusive CMI/CFM modules. Cincoze has launched a new Stackable Expansion Box (SEB) for the DC-1300 series. The SEB uses the built-in dual M.2 B Key slots to support I/O, CANbus, and Fieldbus modules. This design enhances its capabilities for smart manufacturing, transportation, energy management, and other applications.

    Rugged, Compact, and Flexible Deployment

    The DC-1300 series is compact (185 x 131 x 56.5 mm) and designed for space-limited factory automation applications. It supports various installation methods, including wall mounting, side mounting, and DIN rail mounting, for convenient and flexible deployment in machines, control cabinets, or automated guided vehicles. It supports wide temperature (-40 to 70°C) and wide voltage (9-48 VDC). It also complies with EMC standards (IEC 61000-6-2/4) and the US military shock standard (MIL-STD-810H) to ensure stable operation in harsh industrial environments.

    About Cincoze

    Cincoze was established in 2012 and is headquartered in New Taipei City, Taiwan. It specializes in the design and manufacture of rugged embedded computing systems tailored for edge computing and AIoT applications. Their product portfolio includes rugged embedded computers, convertible embedded systems, industrial panel PCs and monitors, and embedded GPU computers. These solutions serve industries such as manufacturing, intelligent transportation, railway computing, in-vehicle computing, warehouse and logistics, energy, kiosks, and security and surveillance. Cincoze has experienced rapid and steady growth, maintaining a compound annual growth rate (CAGR) of 40% for eight consecutive years. The company has expanded its global presence with facilities in the USA, China, and Germany, and a network spanning over 40 countries with more than 50 value-added partners.

    Source: Cincoze

  • BOXX Announces Compatibility with NVIDIA GeForce RTX 50 GPUs

    BOXX Announces Compatibility with NVIDIA GeForce RTX 50 GPUs

    AUSTIN, TX, Jan 24, 2025 – BOXX Technologies has announced that, as a supplier of NVIDIA-Certified Systems, select BOXX products will support the new NVIDIA GeForce RTX 50 Series GPUs available as of date. The new NVIDIA Blackwell architecture GPUs combine the latest-generation RT Cores and Tensor Cores with GDDR7 memory, increased clock speed, and VRAM, to deliver improved AI, graphics, rendering, and ray-tracing performance.

    “Our support for the latest NVIDIA GeForce RTX 50 Series technology is essential because these GPUs accelerate application performance and creative workflows,” said BOXX CEO Kirk Schell. “Now video editors, VFX artists, animators, architects, and other content creators can take advantage of all AI has to offer and design, render, collaborate, and meet project deadlines faster than ever before.”

    The NVIDIA GeForce RTX 50 Series GPU supported by BOXX systems features the latest Blackwell technology for accelerated AI and ray tracing, as well as up to1.8TB/s of GDDR7 memory bandwidth to power:

    • Faster content creation
    • Multi-application workflows
    • Improved AI and machine learning support

    The new GPU series also offers 33% more VRAM than the previous generation, enabling users of Adobe Creative Cloud, DaVinci Resolve, Cinema 4D, Revit, Rhino, and other applications supported by NVIDIA Studio Drivers, to optimize creative tasks like:

    • Next-gen raytracing & AI-powered graphics
    • AI-assisted video editing and rendering
    • Real-time 8K video editing

    To accelerate V-Ray, Autodesk Arnold, Lumion, and other 3D renderers supported by NVIDIA Studio Drivers, the new NVIDIA GeForce RTX 50 Series GPUs inside BOXX systems feature DLSS 4 with Multi Frame Generation which also delivers superior image quality by multiplying frame rates by up to eight times over traditional rendering.

    In addition to the new NVIDIA GeForce RTX GPUs, these select BOXX products include multi-core Intel Core Ultra, AMD Ryzen 9000 or AMD Ryzen Threadripper and Intel Xeon W processors, liquid cooling, ample memory, and plenty of hard drives.

    “Demanding graphics and workflows require powerful, purpose-built solutions,” added Schell, “and NVIDIA GeForce RTX 50 Series GPUs supported by innovative BOXX solutions give creators the performance they need to run the latest 3D and AI-accelerated applications.”

    About BOXX

    Founded in 1996 and headquartered in Austin, Texas, BOXX Technologies specializes in high-performance computer workstations tailored for professionals in architecture, engineering, product design, visual effects, animation, and data science. Their product lineup includes deskside and rack-mounted workstations, rendering systems, and servers, all designed to accelerate workflows in industries such as media and entertainment, manufacturing, and government. BOXX’s APEXX series, for instance, offers performance-tuned, liquid-cooled systems featuring the latest Intel Core Ultra and AMD Ryzen processors, delivering unparalleled speed and reliability. The company maintains its design, manufacturing, and support operations at its Austin headquarters, ensuring quality control and customer service excellence. With a global presence through 40 international resellers, BOXX provides purpose-built solutions that enhance productivity and meet the demanding requirements of creative professionals worldwide. As of 2024, BOXX Technologies employs approximately 67 individuals and has an estimated annual revenue of $24.1 million.

    Source: BOXX

  • MediaTek, Cadence Partner to Accelerate 2nm Design Process

    MediaTek, Cadence Partner to Accelerate 2nm Design Process

    SAN JOSE, CA, Jan 23, 2025 – Cadence has announced that MediaTek has adopted the AI-driven Cadence Virtuoso Studio and Spectre X Simulator on the NVIDIA accelerated computing platform for its 2nm development. As design size and complexity continue to escalate, advanced-node technology development has become increasingly challenging for SoC providers. To meet the aggressive performance and turnaround time (TAT) requirements for its 2nm high-speed analog IP, MediaTek is leveraging Cadence’s proven custom/analog design solutions, enhanced by AI, to achieve a 30% productivity gain.

    “As MediaTek continues to push technology boundaries for 2nm development, we need a trusted design solution with strong AI-powered tools to achieve our goals,” said Ching San Wu, corporate vice president at MediaTek. “Closely collaborating with Cadence, we have adopted the Cadence Virtuoso Studio and Spectre X Simulator, which deliver the performance and accuracy necessary to achieve our tight design turnaround time requirements. Cadence’s comprehensive automation features enhance our throughput and efficiency, enabling our designers to be 30% more productive.”

    MediaTek has used the Virtuoso ADE Suite to add its AI-based optimization algorithm to streamline future product development. This has helped its designers work more efficiently on circuit designs. Cadence’s Spectre X running on NVIDIA H100 GPUs delivers the same accuracy as Spectre X running on CPUs while delivering up to a 6X performance improvement for post-layout simulations of large, advanced-node designs.

    “Improved performance and efficiency are key to advancing today’s complex chip design processes,” said Dion Harris, director of accelerated computing at NVIDIA. “With Cadence’s Spectre X running on NVIDIA Hopper GPUs, companies like MediaTek can accelerate the verification of their complex post-layout designs, maximize analog circuit simulation performance and reduce time to market.”

    MediaTek’s analog layout team now uses the Virtuoso Layout Suite device-level router for custom digital blocks in 2nm technology, improving layout efficiency.Additionally, MediaTek is leveraging AI and Virtuoso’s open platform to create a prototyping placement and low-power prediction process. This approach improves design productivity by 30%.

    “MediaTek’s validation of our latest Virtuoso Studio release and Spectre X Simulator on NVIDIA’s accelerated computing platform demonstrates that Cadence’s continued investment in enhancing our industry-leading custom design solutions and AI tools is a game changer for our customers’ most challenging 2nm designs,” said Vinod Kariat, corporate vice president and general manager of the Custom Products Group at Cadence. “Bringing the power of AI and GPUs to Spectre X enables MediaTek to solve its large-scale verification simulation challenges even more quickly, without sacrificing accuracy.”

    Source: Cadence

  • Keysight Launches Chiplet PHY Designer 2025 for AI, Data Center Apps

    Keysight Launches Chiplet PHY Designer 2025 for AI, Data Center Apps

    SANTA ROSA, CA, Jan 23, 2025 – Keysight Technologies has announced the launch of Chiplet PHY Designer 2025, its latest solution for high-speed digital chiplet design tailored to AI and data center applications. The enhanced software introduces simulation capabilities for the Universal Chiplet Interconnect Express (UCIe) 2.0 standard and adds support for the Open Computer Project Bunch of Wires (BoW) standard. As an advanced, system-level chiplet design and die-to-die (D2D) design solution, Chiplet PHY Designer enables pre-silicon level validation, streamlining the path to tapeout.

    As AI and data center chips grow more complex, ensuring reliable communication between chiplets becomes crucial for performance. The industry is addressing this challenge through open, emerging standards like UCIe and BoW that define the interconnects between chiplets within an advanced 2.5D/3D package. When designers use these standards and ensure chiplets meet compliance, they help expand chiplet interoperability while lowering development costs and risks in semiconductor development.

    Key Benefits of the Chiplet PHY Designer 2025:

    • Ensures Interoperability: Verifies designs meet UCIe 2.0 and BoW standards, enabling seamless integration across advanced packaging ecosystems.
    • Accelerates Time-to-Market: Automates simulation and compliance testing setup, such as Voltage Transfer Function (VTF), simplifying chiplet design workflows.
    • Improves Design Accuracy: Provides insight into signal integrity, bit error rate (BER), and crosstalk analysis, reducing risks of costly silicon re-spins.
    • Optimizes Clocking Designs: Supports advanced clocking scheme analysis, such as quarter-rate data rate (QDR), for precise synchronization in high-speed interconnects.

    Hee-Soo Lee, high-speed digital segment lead, Keysight EDA, said: “Keysight EDA launched Chiplet PHY Designer one year ago as the industry’s first pre-silicon validation tool to provide in-depth modeling and simulation capabilities; this enabled chiplet designers to rapidly and accurately verify that their designs meet specifications before tapeout. The latest release keeps pace with evolving standards like UCIe 2.0 and BoW while delivering new features, such as the QDR clocking scheme and systematic crosstalk analysis for single-ended buses. Engineers using Chiplet PHY Designer save time and avoid costly rework, ensuring their designs meet performance requirements before manufacturing. Early adopters, like Alphawave Semi, attest that Chiplet PHY Designer ensures seamless operation and interoperability for 2.5D/3D solutions available to their chiplet customers.”

    Source: Keysight