ENGtechnica

Category: Electronics

  • Renesas Achieves PSA Certification with CRA Compliance

    Renesas Achieves PSA Certification with CRA Compliance

    TOKYO, Japan, Feb 28, 2025 – Renesas Electronics Corp. announced that it has obtained PSA Certified Level 1 certification with the European Cyber Resilience Act (CRA) compliance extension for three of its latest microcontroller Groups (MCUs). The certification, evaluated by Applus+ Laboratories, marks a significant step in Renesas‘ commitment to cybersecurity and compliance with upcoming European regulations.

    The certified RA4L1 MCU Group features low power, 32-bit microcontrollers (MCUs) based on the Arm Cortex-M33 (CM33) core with Arm TrustZone technology, delivering an ideal balance of low voltage operation, low power consumption and high performance. The integrated low power features, advanced security engines, and communication interfaces make the devices ideal for industrial automation, home appliances, smart home, consumer, building/home automation and medical/healthcare applications. 

    The certified RA8E1 and RA8E2 MCU Groups, both based on the Arm Cortex-M85 (CM85) architecture, are designed for a wide range of applications including industrial automation, home appliances, smart home systems, and medical devices. The RA8E1 MCU Group features Arm Helium technology for Vision and Voice AI applications, while the RA8E2 MCU Group incorporates a Graphics LCD for advanced Human-Machine Interface (HMI) solutions.

    PSA Certified has introduced an extension to its Level 1 certification that addresses the compliance requirements of the upcoming European Cyber Resilience Act. The new regulation, set to become mandatory in December 2027, will apply to a broad spectrum of digital products.

    “We’re proud to be at the forefront of IoT security,” said Daryl Khoo, vice president of the embedded processing marketing division at Renesas. “Achieving PSA Certified Level 1 with the CRA compliance extension demonstrates our commitment to providing our customers with secure, future-proof solutions.”

    “With the continued adoption of edge AI devices across all markets and new government regulations coming into effect, security must be prioritized to ensure trusted AI deployment, protecting both businesses and consumers,” said David Maidment, senior director, market strategy at Arm. “Initiatives like PSA Certified are fundamental to driving robust device security and we congratulate Renesas on these new certifications which showcase security leadership in the age of AI.”

    Jose Ruiz, cybersecurity BU director at Applus+ Laboratories, added, “We are committed to providing cybersecurity evaluation solutions that boost market trust and help vendors comply with regulatory requirements. Reducing fragmentation in cybersecurity certification is key, and we welcome PSA Certified’s efforts to align with other private schemes as well as governmental requirements.”

    PSA Certified Level 1 provides extra extensions to meet the European RED directive and the UK PSTI regulation. These apply to connected and IoT products, adding value for manufacturers to achieve global security standards. Renesas has also earned PSA Certified Level 3 RoT Component certification for the RA8D1, RA8M1, and RA8T1 MCU Groups. This shows Renesas’ commitment to security, including physical protections for the Root of Trust.

    About Renesas Electronics Corp.

    Renesas Electronics Corp. is a Japanese semiconductor manufacturer headquartered in Tokyo, Japan. The company specializes in research, development, design, manufacture, sale, and servicing semiconductor products. Renesas offers a portfolio that includes microcontrollers, analog products, power devices, and system-on-chip (SoC) solutions. The products serve various industries, notably automotive, industrial, infrastructure, and Internet of Things (IoT) sectors. As of Dec. 31, 2024, Renesas employs approximately 21,204 individuals worldwide. In the fiscal year ending December 31, 2024, Renesas reported revenue of approximately ¥1,348.5 billion, while the company’s operating profit for the same period was approximately ¥223.0 billion.

    About the Applus+ Group

    Applus+ Group, founded in 1996, is a global leader in testing, inspection, and certification services, headquartered in Madrid, Spain. The company offers a range of solutions, including non-destructive testing, quality control, project management, supplier and facility inspection, asset certification, and integrity services. Applus+ serves diverse industries such as energy, automotive, aerospace, construction, and telecommunications. With a presence in over 65 countries and a workforce exceeding 25,000 employees, the company reported revenues of €2.049 billion in 2022. Applus+ operates through several divisions, including Energy & Industry, Laboratories, Automotive, and IDIADA, providing specialized services like statutory vehicle inspections, product testing, system certification, and automotive engineering solutions.

  • ROHM Launches 650V GaN HEMTs in TOLL Package

    ROHM Launches 650V GaN HEMTs in TOLL Package

    Compact design features excellent heat dissipation, high current capacity, and superior switching performance

    SANTA CLARA, CA and Kyoto, Japan, Feb 28, 2025 – ROHM Semiconductor has announced the GNP2070TD-Z 650V GaN HEMTs in the TO-Leadless (TOLL) package. The TOLL package is being adopted in applications that require power handling, specifically inside industrial equipment and automotive systems, featuring a compact design with heat dissipation, high current capacity, and improved switching performance. For this launch, package manufacturing has been outsourced to ATX Semiconductor (Weihai) Co., Ltd. (hereinafter ATX), an experienced OSAT (Outsourced Semiconductor Assembly and Test) provider.

    Boosting the efficiency of motors and power supplies is key to lowering global electricity use, which is essential for building a decarbonized society. New materials like Silicon Carbide (SiC) and Gallium Nitride (GaN) can significantly improve the performance of these power devices. Their adoption is expected to enhance power supply efficiency.

    ROHM began mass production of its 1st generation 650V GaN HEMTs in April 2023, followed by the release of power stage ICs that combine a gate driver and 650V GaN HEMT in a single package. This time, ROHM has developed the product incorporating 2nd generation elements in a TOLL package and added it to the existing DFN8080 package to strengthen ROHM’s 650V GaN HEMT package lineup – meeting the market demand for even smaller and more efficient high-power applications.

    The new products use 2nd generation GaN-on-Si chips in a TOLL package. They excel in performance in the device metric that links ON-resistance to output charge. This leads to smaller sizes and energy efficiency in power systems that need to handle high voltage and high-speed switching.

    ROHM product achieves industry-leading device performance metrics among GaN HEMTs in the TOLL package

    To achieve mass production, ROHM leveraged proprietary technology and expertise in device design, cultivated through a vertically integrated production system, to carry out design and planning. Under the collaboration announced in December 2024, front-end processes are carried out by Taiwan Semiconductor Manufacturing Company Limited (TSMC); back-end processes are handled by ATX. In addition, ROHM plans to partner with ATX to produce automotive-grade GaN devices.

    To address the growing use of GaN devices in the automotive sector that is projected to speed up in 2026, ROHM will work on introducing automotive-grade GaN devices. This will be done by enhancing partnerships and boosting its development efforts.

    Liao Hongchang, director and general manager, ATX said, “We are extremely pleased to have been entrusted with production by ROHM, a company renowned for its advanced manufacturing technologies and in-house production facilities that cover everything from wafer fabrication to packaging. We began technical exchanges with ROHM in 2017 and are currently exploring possibilities for deeper collaboration. This partnership was made possible due to ATX’s track record and technical expertise in the back-end manufacturing of GaN devices. Looking ahead, we also plan to collaborate on ROHM’s ongoing development of automotive-grade GaN devices. By strengthening our partnership, we aim to contribute to energy conservation across various industries and the realization of a sustainable society.”

    Satoshi Fujitani, general Manager, AP production headquarters, ROHM Co., Ltd. said, “We are delighted to have successfully produced 650V GaN HEMTs in the TOLL package, achieving sufficient performance. ROHM not only offers standalone GaN devices but also provides power solutions that combine them with ICs, leveraging ROHM’s expertise in analog technology. The knowledge and philosophy cultivated in the design of these products are also applied to device development. Collaborating with OSATs such as ATX, that possess advanced technical capabilities, allows us to stay ahead in the rapidly growing GaN market while utilizing ROHM’s strengths to bring innovative devices to market. Going forward, we will continue to enhance the performance of GaN devices to promote greater miniaturization and efficiency in a variety of applications, contributing to enrich people’s lives.”

    Application Examples

    • Power supplies for servers, communication base stations, industrial equipment and more.
    • AC adapters (USB chargers), PV inverters, ESS (Energy Storage System)
    • Wide range of power supply systems with 500W to 1kW output power

    Online Sales Information

    • Sales Launch Date: December 2024
    • Applicable Part No: GNP2070TD-ZTR
    • The products will be available at DigiKey, Mouser and Farnell from March, and will also be offered at other online distributors as they become available.

    EcoGaN Brand

    This refers to ROHM’s new lineup of GaN devices, which contribute to energy conservation and miniaturization by maximizing GaN characteristics to achieve lower application power consumption, smaller peripheral components, and simpler designs requiring fewer parts.

    Source: ROHM Semiconductor

    About ROHM Semiconductor

    ROHM Co., Ltd., established in 1958, is a Japanese electronics manufacturer headquartered in Kyoto, Japan. The company specializes in designing and producing various electronic components, including integrated circuits (ICs), semiconductors, and optoelectronics. ROHM serves multiple industries, such as automotive, industrial equipment, consumer electronics, and telecommunications. Their product portfolio encompasses monolithic ICs, power modules, transistors, diodes, light-emitting diodes (LEDs), and capacitors. As of 2017, ROHM reported annual revenues of approximately ¥352 billion. With a global presence, the company operates in regions including Asia, the Americas, and Europe, supplying high-quality electronic components to clients worldwide.

    About ATX Semiconductor (Weihai) Co., Ltd.

    ATX Semiconductor (Weihai) Co., Ltd. is a semiconductor and materials supplier headquartered in Weihai, Shandong Province, China. The company specializes in providing integrated services, including testing, packaging, assembly systems, and product delivery, catering to industries such as technology, electronic components, electronics, and semiconductors. Originally founded as Aimhigh, a Korean company, it was acquired by ASE Group in 2008 and later became part of the ATX Group, a globally recognized provider of IC assembly and testing services. ATX Semiconductor (Weihai) is known for its comprehensive turnkey solutions, including package design, assembly, testing, and product delivery. It serves diverse clients in the semiconductor industry as a leading company in next-gen semiconductor device development utilizing proprietary intellectual properties and core technologies. ATX has established close, long-term collaborative relationships with the world’s top 10 power device companies.

  • Siemens, DOMO Partner for Sustainability in Electrical Industry

    Siemens, DOMO Partner for Sustainability in Electrical Industry

    ERLANGEN and LEUNA, Germany, Feb 27, 2025 – Siemens Smart Infrastructure and DOMO Chemicals  announced a significant milestone in their joint effort to promote sustainable practices in the electrical industry. DOMO Chemicals has developed and validated a new, high-performance TECHNYL 4EARTH polyamide 6 (PA6) material to be used for Siemens applications that incorporate recycled content and advanced flame-retardant technology.

    For the first time, Siemens will use this material for electrical safety products. The innovative TECHNYL 4EARTH material, developed by DOMO Chemicals, will enable Siemens to produce covers and housings of the Siemens SENTRON 5SV3 residual current circuit breakers (RCCB), type A/AC while offering the same performance and quality as conventional materials, which is a prerequisite for a safety product. RCCBs enhance electrical safety by disconnecting power when they detect a current imbalance, preventing electric shocks and fires. They are essential in both residential and commercial electrical installations.

    Composed of 50 percent recycled content, including chemically recycled PA6 from various post-industrial and post-consumer sources such as fibers, textile filaments, and glass reinforcement, the material reduces the environmental impact of the manufacturing process without compromising performance or quality.

    Siemens: Advancing circularity in electrical safety

    Andreas Matthé, CEO Electrical Products at Siemens Smart Infrastructure. Image: Siemens

    “We want to lead the industry with smart and sustainable technology,” said Andreas Matthé, CEO of electrical products at Siemens Smart Infrastructure. “It’s our ‘new normal’ to deploy as much sustainable material as possible for each new product to support our customers in achieving both optimized operations and their environmental goals. We are delighted to promote circularity and responsible use of resources in the electrical and electronics industry together with our partner DOMO Chemicals”. 

    The SENTRON 5SV3 RCCBs, type A/AC, meet the criteria of the recently introduced Siemens EcoTech label. Besides using sustainable materials, the SENTRON RCCBs are designed to exceed the standard lifetime expectations set by IEC 61008-1. With an impressive 10,000 operating cycles, the devices offer superior mechanical and electrical life, ensuring steadfast performance and longevity. With SENTRON 5SV RCCBs, type A/AC, existing application functionality can be easily enhanced. The standardized accessory system allows easy hardware upgrades, including auxiliary switches, undervoltage releases, and more. This unified system of function extensions ensures that machines and switchboards remain productive and cost-effective for longer periods.

    About Siemens Smart Infrastructure

    Siemens Smart Infrastructure (SI), headquartered in Zug, Switzerland, is a division of Siemens AG that focuses on intelligently connecting energy systems, buildings, and industries to enhance the way we live and work. SI offers a portfolio of across-the-board building automation systems, heating, ventilation, air conditioning (HVAC) controls, fire safety and security systems, energy performance services, grid resilience solutions, and electric vehicle charging infrastructure. Serving sectors such as data centers, energy, and various industrial applications, SI addresses the challenges of urbanization and climate change by providing innovative solutions. In fiscal year 2024, SI achieved a profit margin of 17.3%. The division employs approximately 78,500 people globally.

    About DOMO Chemicals

    Founded in 1991, DOMO Chemicals is a Belgian company specializing in the production of engineering plastics, specialty polymers, and film chemicals. Headquartered in Leuna, Germany, the company serves various industries, including automotive, food, medical, pharmaceutical, and electronics. DOMO offers a comprehensive range of nylon resins and intermediates, complemented by polymers and chemicals, to meet diverse client needs. Over the years, the company has expanded its global presence through strategic acquisitions, such as the 2020 purchase of Solvay’s European Performance Polyamides Business, enhancing its position in the polyamide market. As of 2024, DOMO Chemicals employs approximately 2,000 professionals.

  • Mouser Offers Digi ConnectCore MP255 Kit

    Mouser Offers Digi ConnectCore MP255 Kit

    Image: Mouser

    MANSFIELD, TX, Feb 25, 2025 – Mouser Electronics, Inc., has announced that they have started shipping the new Digi ConnectCore MP255 development kit. The kit boasts a versatile, secure, cost-effective wireless system-on-module (SOM) designed for maximum power efficiency to support battery-powered and industrial AI applications.

    The Digi ConnectCore MP255 development kit, available from Mouser, features a robust STMicroelectronics STM32MP255C 64-bit microprocessor tailored for industrial settings, with a neural processing unit (NPU) and image signal processor (ISP) for edge AI and computer vision applications and time-sensitive networking (TSN), in a compact SMTplus form factor (30 x 30 mm), making it ideal for small portable devices and Industry 4.0 applications. The ConnectCore MP255 kit also delivers access to the STM32MP255C’s high-end graphics capabilities, such as an integrated 3D GPU, video encoder and decoder (VPU), high-resolution MIPI, LVDS or parallel display interfaces, as well as a MIPI camera port with an ISP and the flexibility to run AI applications on the CPU, GPU, or NPU.

    The ConnectCore MP255 kit also supports high-end edge computing applications like machine vision, leveraging multimedia capabilities made possible by the comprehensive ST Edge AI ecosystem, providing fully integrated wireless connectivity with pre-certified Wi-Fi 6 (tri-band 6E ready), 802.11ax and Bluetooth 5.4, along with PCIe Gen2, USB 3.0, CAN-FD and Gigabit Ethernet with TSN support.

    Source: Mouser

    About Mouser

    Mouser Electronics, established in 1964 and based in Mansfield, Texas, is a global distributor of semiconductors and electronic components. The company supports the automotive, aerospace, consumer electronics, and telecommunications industries. It offers over one million unique products from over 1,200 top manufacturers, including Texas Instruments, Intel, TE Connectivity, and Analog Devices. Mouser operates 28 locations worldwide and employs more than 4,000 people. Its annual revenue exceeds $4 billion, making it the seventh-largest electronic component distributor globally. The company’s distribution facility in Texas spans one million square feet, ensuring fast order processing and shipping to over 650,000 customers in 223 countries and territories. As part of TTI, Inc. and the Berkshire Hathaway group of companies, Mouser remains focused on providing design engineers and buyers with the latest products and technologies.

    About Digi

    Digi International Inc., founded in 1985, provides Internet of Things (IoT) connectivity products and services. Headquartered in Hopkins, MN, the company offers many solutions, including embedded and wireless modules, cellular routers, and communication software catering to industrial automation, transportation, energy, and healthcare. Digi’s offerings are designed to support business and mission-critical applications, ensuring reliable and secure data communication across various sectors. As of 2023, the company employs approximately 822 individuals. In the fiscal year 2023, Digi International reported revenues of $444.8 million, reflecting its strong position in the IoT market. With a global presence, the company maintains regional sales offices throughout North America, Europe, and Asia. It operates engineering locations in North America and Europe, underscoring its worldwide commitment to innovation and customer support.

  • Mouser Ships Nordic’s Thingy:91 X for Wireless IoT

    Mouser Ships Nordic’s Thingy:91 X for Wireless IoT

    Image: Mouser

    MANSFIELD, TX, Feb 26, 2025 – Mouser Electronics, Inc. announced that it has started shipping the new Thingy:91 X prototyping platform from Nordic Semiconductor. The Thingy:91 X is an easy-to-use, battery-operated prototyping platform for cellular Internet of Things (IoT) proof-of-concept (PoC) demos and initial cellular IoT device development for logistics, asset tracking, smart city, predictive maintenance, industrial and wearable applications.

    The Nordic Semiconductor Thingy:91 X, available from Mouser, is designed to address the needs of emerging low-power cellular IoT applications utilizing Nordic’s nRF9151 cellular IoT system-in-package (SiP) with an integrated Arm Cortex-M33 CPU and Arm TrustZone and CryptoCell security technology that supports LTE-M, NB-IoT, GNSS, and NR+ certified for global operation. The ready-for-IoT Thingy:91 X platform ships with an asset-tracking app already loaded and a whole swathe of sensors to monitor the environment and movement, enabling it to be used in a wide range of use cases. The Thingy:91 X features multiple digital and analog interfaces and peripherals for various design scenarios and interface headers for a debug board connector and Qwiic, STEMMA QT, and Grove-compatible expansion board connectors.

    The Thingy:91 X Prototyping Platform has all the necessary modem firmware, RTOS, application software examples, and hardware reference designs to implement a complete cellular IoT design. The Thingy:91 X features two user-programmable buttons for user input, with user-programmable RGB LEDs for output, along with a Nano/4FF SIM card slot, supporting (e)SIM, and bundled Onomondo and Wireless Logic SIM cards preloaded with data to connect to nRF Cloud out-of-the-box. The package also includes a 1350mAh rechargeable Li-Po battery to facilitate prototype field testing.

    Source: Mouser

    About Mouser

    Founded in 1964, Mouser Electronics is a global distributor of semiconductors and electronic components, specializing in introducing new products and technologies to design engineers and buyers. Mouser offers a vast inventory of over a million unique SKUs from more than 1,200 manufacturer brands, including Texas Instruments, Intel, TE Connectivity, and Analog Devices, serving industries such as consumer electronics, automotive, aerospace, and telecommunications. Headquartered in Mansfield, TX, the company’s global distribution center operates 24/7, processing and shipping orders to over 650,000 customers across 223 countries and territories. With over 4,000 workers and 28 locations worldwide, Mouser is part of the Berkshire Hathaway family of companies and reported annual revenue exceeding $4 billion, ranking it the seventh-largest electronic component distributor globally.

    About Nordic Semiconductor

    Nordic Semiconductor, established in 1983, is a Norwegian fabless semiconductor company headquartered in Trondheim, Norway. The company specializes in ultra-low-power wireless communication technology and provides integrated circuits (ICs) and solutions that power the Internet of Things (IoT). Their product portfolio includes System-on-Chip (SoC) and System-in-Package (SiP) solutions supporting wireless technologies such as Bluetooth Low Energy (LE), Wi-Fi, Thread, Zigbee, Matter, LTE-M, and NB-IoT. The products serve consumer electronics, healthcare, smart home, industrial automation, and wearable technology. As of 2023, Nordic Semiconductor employs over 1,500 people worldwide. In 2023, the company reported a revenue of $542.87 million.

  • Molex Launches EMI-Filtered Components for Aerospace, Defense

    Molex Launches EMI-Filtered Components for Aerospace, Defense

    Molex’s latest EMI-filtered interconnects and RF components provide advanced solutions for improved reliability in aerospace and defense systems.

    LISLE, IL, Feb 26, 2025 – Molex has launched a comprehensive lineup of Electromagnetic Interference (EMI) Filtered interconnects and Radio Frequency (RF) components to improve signal integrity and electromagnetic compatibility for mission-critical aerospace and defense applications. Molex’s new family of EMI-Filtered D-Sub Pi Adapters and Connectors, EMI Filter Plates, Fixed RF Coaxial Attenuators, and RF Coaxial Terminations are engineered to enhance the overall reliability and efficiency of crucial electronic systems. The launch emphasizes Molex’s commitment to innovation and product development in Aerospace and Defense following its recent AirBorn acquisition.

    “These new RF components and EMI-Filtered interconnects extend Molex’s legacy of RF excellence while adding significant product breadth and depth for tackling the toughest connectivity challenges,” said Steven DeFrancesco, general manager, RF, Molex. “Available in an extensive selection of mechanical configurations, we offer customers a ‘one-stop shop’ for compact, lightweight and ruggedized connectivity solutions needed to perform without fail in the harshest, most demanding environments.”

    Engineered to comply with rigorous regulatory standards, the solutions integrate into a diverse range of aerospace and defense applications. These include radar systems, airborne radios, night-vision sensors, flight controls, engine controls, navigation systems, tactical weapons, and military global positioning systems. Inventive materials and adaptable designs cater to varying sizes, weights, and power specifications, guaranteeing that these advancements apply to other sectors, such as medical equipment, telecommunications, and industrial automation.

    Improve Signal Integrity, Minimize Interference

    Molex’s EMI-Filtered D-Sub Pi Adapters and Connectors mitigate EMI and enhance signal integrity while improving compliance with stringent standards. Featuring an optimized Pi filter design, the products provide superior noise suppression, as well as higher capacitance and inductance values for better frequency attenuation. High-quality conductive and shielding materials increase electrical performance and mechanical durability for greater resilience to vibration, shock, extreme temperatures, lightning and exposure to contaminants.

    The latest EMI Filter Plates are designed to protect system components and mitigate signal loss caused by electronic noise, all while removing the necessity for separate filters, streamlining assembly time, and reducing costs. Featuring up to 50 lines in a compact design, the filter plates improve design versatility and minimize the space needed on Printed Circuit Boards (PCBs). Snap-in options are available for frequencies ranging from 5 to 18 GHz, making installation easier in applications with limited space. Customers can adjust plate size and shape to fit unique enclosures, while the availability of different materials addresses a vast range of environmental concerns.

    Circular EMI Filter Connectors are also available with advanced EMI filtering and line-to-line isolation to ensure reliable signal integrity and consistent power delivery. Customers can choose insulated and ground-line options in hermetically sealed and bayonet styles for better resiliency under challenging conditions.

    Stable RF System Performance, Precise Power Control

    Molex’s Fixed RF Coaxial Attenuators and RF Coaxial Terminations offer durability and environmental resiliency for aerospace and defense applications. The products are well-suited for military aircraft, missile defense systems, SATCOM links, ship-signal exploitation devices, and electronic warfare systems. Moreover, they improve the reliability of wireless infrastructure, telecommunications, and automotive applications, spanning test and measurement equipment, cell-site infrastructure, network analyzers, automotive test environments, and distributed antenna systems.

    The new attenuators deliver precise signal power control and excellent signal integrity to ensure consistent, long-term performance. In addition, they provide heat dissipation at power levels up to 50W and precision impedance matching, helping customers improve system efficiency, prevent equipment damage, improve test-results reliability, and reduce downtime by extending component lifespans. Both product lines are engineered with solderless contacts to withstand wide temperature ranges, shock and vibration forces, and exposure to harsh environments.

    Product Availability

    Molex’s EMI-Filtered D-Sub Pi Adapters and Connectors are available in more than 250 mechanical configurations and countless custom options, including high-density and circular connectors in various shell sizes, including 9, 15, 25, 37, and 50. Molex’s EMI Filter Plates are also available in different sizes, shapes, and mounting options, which can be tailored to meet specific applications.

    Supporting various power ratings and attenuation values, Molex’s Fixed RF Coaxial Attenuators ensure power handling up to 100W and work with RF connectors, including 2.92mm, N-Type, and SMA. They are also compatible with 3.50mm, K-Type, and MIL-STD-348 connectors. The RF Coaxial Terminations are available in various power ranges, power-handling capabilities, and connector types, including military-grade products. They are available through Molex’s global distribution partners, with stock available immediately from Mouser Electronics and DigiKey Electronics.

    Source: Molex

    About Molex

    Molex, established in 1938 and headquartered in Lisle, Illinois, is a global leader in electronic, electrical, and fiber optic connectivity systems. The company offers over 100,000 products, including electrical connectors, optical fiber connectors, and switches, serving industries such as data communications, medical, industrial, automotive, and consumer electronics. Molex pioneered the widely adopted Molex connector in personal computing. As of 2023, Molex reported annual revenues of $3.6 billion and employed approximately 45,000 people worldwide.

  • DigiKey, Qorvo Announce Global Distribution Agreement

    DigiKey, Qorvo Announce Global Distribution Agreement

    DigiKey will distribute Qorvo’s leading connectivity and power solutions worldwide. Image: DigiKey

    THIEF RIVER FALLS, MN, Feb 26, 2025 – DigiKey and Qorvo has announced a worldwide distribution agreement. The collaboration will further enhance the awareness, availability and speed of delivery of Qorvo’s high-performance solutions to customers around the world.

    DigiKey will distribute Qorvo’s connectivity and power solutions worldwide.

    The collaboration with DigiKey further extends Qorvo’s product reach across North America, EMEA and APAC regions, ensuring delivery and additional support for customers in markets such as IoT, defense, aerospace, automotive, power and wireless infrastructure. By leveraging DigiKey’s logistics and distribution capabilities, Qorvo will satisfy growing demand and accelerate its customers’ time-to-market.

    “For Qorvo, delivering innovative, high-performance solutions to our customers is a top priority, and our agreement with DigiKey reinforces that commitment,” said Corbin Graham, senior director of global distribution at Qorvo. “This collaboration expands global access to our products, ensuring our customers receive the advanced technologies they need with exceptional efficiency and support.”

    DigiKey’s expansive product offering that includes over 15.9 million products, enables Qorvo’s customers to order entire bills of materials in one place and receive orders efficiently and in cost saving time. This minimizes lead times and enhances project timelines.

    “We are excited to partner with Qorvo to bring their innovative RF and power semiconductor solutions to our customers around the globe,” said Ken Paxton, director of advanced semiconductors at DigiKey. “By making Qorvo’s extensive portfolio easily accessible to engineers and innovators worldwide, we can propel industries like wireless, smart living, power, defense technology and automotive into the future.”

    Source: DigiKey

    About DigiKey

    DigiKey, founded in 1972 by Ronald Stordahl, is a distributor of electronic components headquartered in Thief River Falls, MN. The company offers an inventory of over 15.9 million products, including integrated circuits, connectors, capacitors, resistors, relays, catering to design engineers and manufacturers across industries such as automotive, aerospace, telecommunications, and consumer electronics. DigiKey serves customers in more than 180 countries, providing services like same-day shipping and a user-friendly online platform. As of 2023, the company reported annual revenues of approximately $5 billion and employed over 5,000 people. DigiKey’s commitment to innovation and customer service has solidified its position as a global leader in electronic component distribution.

    About Qorvo

    Qorvo, Inc., established on January 1, 2015, through the merger of TriQuint Semiconductor and RF Micro Devices, is a provider of radio frequency (RF) solutions and core technologies. Headquartered in Greensboro, NC, Qorvo designs and manufactures products including amplifiers, control products, discrete transistors, filters, frequency converters, and power management solutions. The manufactured goods serve various industries such as automotive, consumer electronics, defense and aerospace, industrial, Internet of Things (IoT), mobile devices, and network infrastructure. As of 2024, Qorvo employs approximately 8,700 individuals and reported an annual revenue of approx. $3.8 billion.

  • Baya Systems. Semidynamics Team Up to Advance RISC-V SoC Development

    Baya Systems. Semidynamics Team Up to Advance RISC-V SoC Development

    Baya Systems and Semidynamics Collaborate to Accelerate RISC-V System-on-Chip Development. Image: Baya Systems

    SANTA CLARA, CA and BARCELONA, Spain, Feb 26, 2025 – Baya Systems and Semidynamics have announced a collaboration to boost innovation in the development of hyper-efficient, next-gen platforms for artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC) applications.

    The collaboration integrates Semidynamics’ family of 64-bit RISC-V processor IP cores, known for their memory bandwidth and configurability, with Baya Systems’ WeaveIP Network on Chip (NoC) system IP.  WeaveIP is engineered for ultra-resourceful, high-bandwidth, and low-latency data transport, crucial for the demands of modern workloads. Complementing this is Baya Systems’ software-driven WeaverPro platform that enables rapid system-level optimization, ensuring that key performance indicators (KPIs) are met based on real-world workloads while providing design flexibility for future advancements.

    New computing platforms are essential to meet the demands of advanced AI and machine learning in market segments like data centers, infrastructure, automotive, and edge IoT applications. These platforms should combine processing power with effective data movement to keep up with technological progress. As AI, ML, and HPC workloads increase, and systems expand to larger scales and chiplets, the focus shifts from raw computing power to efficient data transfer between processors and chiplets.

    “Our customers need high-performance compute that doesn’t get bottlenecked by inefficient data transport,” said Roger Espasa, CEO of Semidynamics. “Partnering to pre-integrate with Baya Systems’ WeaveIP technology accelerates development timelines for our mutual customers, eliminating this bottleneck and enabling a new level of performance for AI and HPC applications.”

    Fresh off its Series B funding, Baya Systems has emerged as a key player in semiconductor innovation. Its NoC solutions are chiplet-ready and engineered for extreme scalability, complementing Semidynamics’ flexible, high-bandwidth architectures.

    “Our mission is to support our customers’ processor IP choices while providing the SoC connectivity backbone for the expanding RISC-V ecosystem,” said Dr. Sailesh Kumar, CEO of Baya Systems. “Together with Semidynamics, we’re enabling SoC designers to push the boundaries of performance, efficiency and scalability in AI and HPC applications.”

    Source: Baya Systems

    About Baya Systems

    Baya Systems, founded in March 2023 and headquartered in Santa Clara, CA, specializes in developing intelligent, software-driven, customizable System IP solutions to enhance data movement efficiency in complex System-on-Chip (SoC) and chiplet designs. Their offerings include the WeaverPro software platform and WeaveIP advanced system IP portfolio, which facilitate the design, analysis, and deployment of high-performance, scalable multi-die systems. These solutions cater to industries such as artificial intelligence, automotive, data center infrastructure, and IoT. In January 2025, Baya Systems raised over $36 million in a Series B funding round led by Maverick Silicon, with participation from Synopsys, Matrix Partners, and Intel Capital, to support operational growth and technology development.

    About Semidynamics

    Semidynamics, established in 2016 and headquartered in Barcelona, Spain, is a European provider of RISC-V IP cores. The company specializes in high-bandwidth, high-performance cores equipped with vector and tensor units, primarily serving industries focused on AI and ML applications. Their product lineup includes the Atrevido and Avispado cores, designed for seamless integration into multiprocessor systems. Semidynamics is an active participant in the European Processor Initiative (EPI), contributing to the development of European processors.

  • AI-Driven Battery Management: Infineon and Eatron Extend Collaboration

    AI-Driven Battery Management: Infineon and Eatron Extend Collaboration

    Infineon Mobile Robot. Image: Infineon

    MUNICH, Germany, Feb 25, 2025 – Infineon Technologies AG and Eatron extend their existing partnership for battery management solutions (BMS) in automotive to a comprehensive BMS portfolio, including various industrial and consumer applications. Enabled by Infineon’s PSOC microcontrollers, the collaboration brings together the benefits of AI-powered battery optimization software and advanced power semiconductor components to create a solution that minimizes degradation, detects safety issues, and enhances the performance and reliability of battery-powered systems.

    The technology integrates Eatron’s AI-powered BMS software, based on pre-trained models, featuring SOX, RUL, and Safety Diagnostic, with Infineon’s components, including MOSFETs for battery protection and PSOC 6 AI-based battery management system for state-of-the-art machine learning capabilities. Customers can access a range of benefits, including precise forecasts of battery State of Charge (SOC), reduced system costs, and faster market entry. The collaboration meets the emerging need for advanced battery management systems across industrial and consumer sectors, including light electric vehicles, portable electronics, energy storage, robotics, and power tools.

    The battery management and optimization market is growing fast. It is due to a rising need for more energy efficiency, extended battery life, and predictive maintenance. AI plays a key role in enhancing battery performance, making the Eatron-Infineon technology a top choice for various applications. These include robotics, wearables, portable medical devices, smart home devices, battery-operated IoT products, and low-power energy storage systems.

    Eatron’s software has been pre-validated and deployed on Infineon’s PSoC. It has been benchmarked on an application comprising up to 24 cells against traditional techniques that require cell characterization. The evaluation used a commercially available LG Chem INR21700 M50 cell across a broad temperature range (0–45°C), demonstrating comparable results. These findings underscore the strong value proposition of Eatron-Infineon technology.

    “We’re excited to collaborate with Eatron to bring AI-powered battery optimization software to a wide range of industrial applications. Our PSOC microcontrollers, with their advanced machine learning capabilities, are the perfect fit for Eatron’s AI-powered software suite, enabling customers to unlock new levels of performance, reliability, and safety in their battery-powered systems,” said Cuauhtemoc Medina, industrial application manager at Infineon.

    “We are excited to expand our partnership with Infineon, combining our Advanced SoX and predictive diagnostics software, integrated on the PSOC family to provide market-leading battery management and diagnostics in various industrial applications,” said Dr. Umut Genc, CEO of Eatron.

    AI plays a key role in Infineon’s growth. The company strengthens its market position with innovations such as ultra-thin silicon (Si) wafers and 300-millimeter gallium nitride (GaN). It also leads in 200 mm silicon carbide manufacturing technology.

    Source: Infineon

    About Eatron

    Eatron Technologies, founded in 2017, is a technology company headquartered in Warwick, United Kingdom. Specializing in AI-powered battery management software, Eatron aims to unlock the full potential of batteries for vehicle and battery manufacturers worldwide. Their Intelligent Software Layer enhances battery performance, safety, and longevity by providing precise state estimations and predictive maintenance capabilities. Serving automotive, mobility, and energy storage industries, Eatron’s solutions are trusted by global OEMs and Tier 1 suppliers. As of December 31, 2023, the company reported an annual revenue of approximately £4.37 million ($5.44 million) and employed 28 people.

    About Infineon

    Infineon Technologies AG, established in 1999 as a spin-off from Siemens AG, is a German semiconductor manufacturer headquartered in Neubiberg, near Munich. The company specializes in designing, developing, and manufacturing a wide range of semiconductor products, including power semiconductors, microcontrollers, sensors, and application-specific integrated circuits (ASICs). These products serve various industries, such as automotive, industrial power control, power and sensor systems, and connected secure systems. Infineon’s solutions are integral to applications like automotive electronics, renewable energy systems, industrial drives, consumer electronics, and security systems. As of the fiscal year ending September 2023, Infineon reported revenues exceeding €16 billion and employed approximately 58,600 people worldwide. The company operates 69 research and development locations and 17 manufacturing sites globally, underscoring its commitment to innovation and technological advancement.

  • Siemens Announces User2User 2025 N America Conference

    Siemens Announces User2User 2025 N America Conference

    Image: Siemens

    PLANO, TX, Feb 20, 2025 – Siemens EDA, a part of Siemens Digital Industries Software, has announced the Siemens EDA North America User2User (U2U) 2025 Conference, taking place on Tuesday, May 20, 2025, in Santa Clara, CA.

    User2User is a free-of-charge technical conference designed by engineers for engineers, offering an opportunity for industry professionals to collaborate, learn, and innovate. The event will feature technical sessions, keynote presentations, hands-on labs, and networking opportunities, all aimed at advancing electronic design automation (EDA) technology and methodology.

    Technology Tracks & Sessions

    Attendees will gain insights into the latest advancements and solutions from Siemens EDA, covering key topics such as:

    • 3DIC Chiplet Package Design
    • AI/ML
    • Aprisa Digital IC Implementation
    • Calibre Solutions Driving Customer Success
    • Cloud Adoption
    • Custom IC
    • Functional Design & Verification
    • Hardware-Assisted Verification
    • High-Level Synthesis/Power Analysis
    • Tessent Test Solutions

    Exclusive Post-Conference Technical Training – May 21, 2025

    For the second year in a row, Siemens EDA is offering an optional second day of technical training on Wednesday, May 21, 2025. This exclusive training will provide in-depth instruction on:

    • Introduction to Software Design Pattern Concepts in SystemVerilog & UVM
    • Tessent & IJTAG

    Attendees of these specialized training sessions will receive a free Online Digital Twin (ODT) license for the full self-paced training course, allowing them to deepen their expertise and apply hands-on labs in Siemens’ virtual cloud-enabled environment.

    Registration & Cost

    • User2User Conference (May 20): Free of charge, including sessions, lunch, and parking.
    • Optional Technical Training (May 21): $350

    For more details and registration, please visit Siemens EDA U2U website.

    Source: Siemens

    About Siemens Digital Industries Software

    Siemens Digital Industries Software provides comprehensive solutions for digital transformation, offering software and services that enable companies to improve product design, manufacturing, and operational processes. It serves a wide range of industries including automotive, aerospace, industrial machinery, electronics, and consumer products. Siemens Digital Industries Software has contributed towards innovation in manufacturing and product lifecycle management (PLM). The company is headquartered in Plano, TX, and is part of Siemens AG.